K3LK8L80CM-MGCT vs K3KL2L20DM-JGCT 比較
詳細並排比較 K3LK8L80CM-MGCT 由 Samsung Electronics 與 K3KL2L20DM-JGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LK8L80CM-MGCT | K3KL2L20DM-JGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 32 Gbit (4 GB) | 48 Gb |
| 組織 | x32 | x64 |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封裝 | FBGA-315 (315-ball) | 441-ball FBGA |
| 工作溫度 | -25C to +85C | -25C to +85C |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 介面 | LPDDR5X (JEDEC low-power DDR) | LPDDR5X (JEDEC low-power DRAM interface) |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 狀態 | Compliant (per JLCPCB listing) | unknown |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| 資料速率 | — | 7500 Mbps |
| Supply Voltage (VDD1) | — | 1.8 V |
| Supply Voltage (VDD2) | — | 1.05 V |
| Supply Voltage (VDDQ) | — | 0.5 V |
| Core Voltage Rail | — | 0.9 V |
| Product Status | — | Mass Production |
| Generation | — | LPDDR5X (1.25x speed, 25% better power efficiency vs LPDDR5) |
| Application Segment | — | AI devices, automotive, mobile |