K3LK8L80CM-MGCT vs K3KL3L30CM-BGCT 比較
詳細並排比較 K3LK8L80CM-MGCT 由 Samsung Electronics 與 K3KL3L30CM-BGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LK8L80CM-MGCT | K3KL3L30CM-BGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 32 Gbit (4 GB) | 64 Gbit |
| 組織 | x32 | x64 |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封裝 | FBGA-315 (315-ball) | [DATA_NEEDED: exact package code and ball count] |
| 工作溫度 | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| 介面 | LPDDR5X (JEDEC low-power DDR) | — |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | Mobile / embedded main memory |
| RoHS 狀態 | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Speed Grade | — | LPDDR5X-7500 (7500 MT/s) |
| Technology | — | Stacked DRAM die, mobile BGA |
| Core Voltage | — | [DATA_NEEDED: VDD core voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: VDDQ voltage] |
| Refresh | — | [DATA_NEEDED: refresh scheme] |
| Standards Compliance | — | JEDEC LPDDR5X specification |