K3LK8L80CM-MGCT vs K3KL7L70EM-MGCU 比較
詳細並排比較 K3LK8L80CM-MGCT 由 Samsung Electronics 與 K3KL7L70EM-MGCU 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K3KL7L70EM-MGCU - 12Gb LPDDR5X DRAM, 315-Ball FBGA | Samsung
K3KL7L70EM-MGCU ✓ 啟用中規格比較
| 參數 | K3LK8L80CM-MGCT | K3KL7L70EM-MGCU |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 32 Gbit (4 GB) | 12 Gbit (1.5 GB) |
| 組織 | x32 | [DATA_NEEDED: organization x32] |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封裝 | FBGA-315 (315-ball) | 315-ball FBGA |
| 工作溫度 | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 介面 | LPDDR5X (JEDEC low-power DDR) | — |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 狀態 | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Speed Grade Suffix | CM-MGCT | -MGCU |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Manufacturer | — | Samsung Electronics |
| 資料速率 | — | [DATA_NEEDED: data rate Mbps/pin] |
| Supply Voltage VDD | — | [DATA_NEEDED: VDD core voltage] |
| Supply Voltage VDDQ | — | [DATA_NEEDED: VDDQ I/O voltage] |
| Bank Architecture | — | [DATA_NEEDED: bank group count] |
| CAS 延遲 | — | [DATA_NEEDED: CAS latency] |
| Refresh | — | Self-refresh and per-bank refresh per JEDEC LPDDR5X |
| Termination | — | On-Die Termination (ODT) |