K3LK8L80CM-MGCT vs K3LKCKC0BM-MGCP 比較
詳細並排比較 K3LK8L80CM-MGCT 由 Samsung Electronics 與 K3LKCKC0BM-MGCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LK8L80CM-MGCT | K3LKCKC0BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5 SDRAM (DRAM) |
| Density | 32 Gbit (4 GB) | — |
| 組織 | x32 | — |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | 500 mV, 900 mV, 1.05 V, 1.8 V |
| 封裝 | FBGA-315 (315-ball) | FBGA-315 (PBGA315) |
| 工作溫度 | -25C to +85C | -25 C to +85 C |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 介面 | LPDDR5X (JEDEC low-power DDR) | Parallel |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 狀態 | Compliant (per JLCPCB listing) | Compliant |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| 記憶體容量 | — | 64 Gbit |
| Memory Organization | — | 2G x32 |
| 資料速率 | — | 6400 Mbps |
| Technology | — | CMOS |
| Volatile / Non-Volatile | — | Volatile |
| Clock Frequency | — | [DATA_NEEDED: clock frequency] |
| Access Time | — | [DATA_NEEDED: access time] |
| Power Consumption - Active | — | [DATA_NEEDED: active power] |
| Power Consumption - Standby | — | [DATA_NEEDED: standby power] |