K3LKCKC0BM-MGCP vs K3KL3L30CM-BGCT 比較
詳細並排比較 K3LKCKC0BM-MGCP 由 Samsung Electronics 與 K3KL3L30CM-BGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LKCKC0BM-MGCP | K3KL3L30CM-BGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM (DRAM) | LPDDR5X SDRAM |
| 記憶體容量 | 64 Gbit | — |
| Memory Organization | 2G x32 | — |
| 資料速率 | 6400 Mbps | — |
| 介面 | Parallel | — |
| Technology | CMOS | Stacked DRAM die, mobile BGA |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V | — |
| 工作溫度 | -25 C to +85 C | [DATA_NEEDED: operating temperature range] |
| 封裝 | FBGA-315 (PBGA315) | [DATA_NEEDED: exact package code and ball count] |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Volatile / Non-Volatile | Volatile | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| Access Time | [DATA_NEEDED: access time] | — |
| Power Consumption - Active | [DATA_NEEDED: active power] | — |
| Power Consumption - Standby | [DATA_NEEDED: standby power] | — |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Density | — | 64 Gbit |
| 組織 | — | x64 |
| Speed Grade | — | LPDDR5X-7500 (7500 MT/s) |
| Core Voltage | — | [DATA_NEEDED: VDD core voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: VDDQ voltage] |
| Refresh | — | [DATA_NEEDED: refresh scheme] |
| Standards Compliance | — | JEDEC LPDDR5X specification |
| Application Class | — | Mobile / embedded main memory |