K3LKCKC0BM-MGCP vs K3LK8L80CM-MGCT 比較
詳細並排比較 K3LKCKC0BM-MGCP 由 Samsung Electronics 與 K3LK8L80CM-MGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LKCKC0BM-MGCP | K3LK8L80CM-MGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM (DRAM) | LPDDR5X SDRAM |
| 記憶體容量 | 64 Gbit | — |
| Memory Organization | 2G x32 | — |
| 資料速率 | 6400 Mbps | — |
| 介面 | Parallel | LPDDR5X (JEDEC low-power DDR) |
| Technology | CMOS | — |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) |
| 工作溫度 | -25 C to +85 C | -25C to +85C |
| 封裝 | FBGA-315 (PBGA315) | FBGA-315 (315-ball) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Volatile / Non-Volatile | Volatile | — |
| RoHS 狀態 | Compliant | Compliant (per JLCPCB listing) |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| Access Time | [DATA_NEEDED: access time] | — |
| Power Consumption - Active | [DATA_NEEDED: active power] | — |
| Power Consumption - Standby | [DATA_NEEDED: standby power] | — |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Density | — | 32 Gbit (4 GB) |
| 組織 | — | x32 |
| Max Data Rate | — | 7500 Mbps |
| Power Efficiency | — | ~25% improvement vs LPDDR5 |
| Application Class | — | Mobile, PC, automotive, on-device AI |
| Speed Grade Suffix | — | CM-MGCT |
| Package Family | — | FBGA -> BGA -> surface mount |
| Typical End Products | — | Smartphones, tablets, edge AI devices |
| Refresh / Standby Modes | — | Self-refresh, deep power-down (per LPDDR5X protocol) |