K4AAG085WA-BCPB vs K4AAG085WA-BCTD 比較
詳細並排比較 K4AAG085WA-BCPB 由 Samsung Electronics 與 K4AAG085WA-BCTD 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG085WA-BCPB | K4AAG085WA-BCTD |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit (2 GB) |
| 組織 | 2G x 8 | 2G x 8 |
| 供應電壓 | 1.2 V | 1.2 V |
| Speed Grade | [DATA_NEEDED: speed grade Mbps for BCPB suffix] | DDR4-2666 (-BCTD) |
| 封裝 | 78FBGA | 78-ball FBGA (78FBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0 C to 85 C (commercial grade, per K4AAG085WA family data) | 0C to +85C |
| 介面 | Parallel (DDR4) | DDR4 parallel, JEDEC DDR4 ballout |
| Clock Type | Synchronous, differential clock | — |
| Bank Architecture | DDR4 bank group architecture | 16 banks in 4 bank groups (DDR4 standard) |
| DLL Mode | DLL Enabled mode operation (per Samsung datasheet abstract) | — |
| Memory Format | DRAM | — |
| RoHS 狀態 | Compliant (per family listing on JLCPCB) | Compliant |
| Temperature Grade Code | C (per Samsung part number coding) | — |
| Speed Bin Code | PB (per Samsung part number coding) | — |
| 資料速率 | — | 2666 Mbps |
| Burst Length | — | BL8 (DDR4 standard) |
| Application Domain | — | Computing, networking, industrial memory |
| Manufacturing Standard | — | JEDEC DDR4 SDRAM |
| Lead Time / Stock | — | [DATA_NEEDED: current stock status] |