K9IUGY8J7B-BCK0 vs K9HUGY8J5B-BCK0 比較
詳細並排比較 K9IUGY8J7B-BCK0 由 Samsung Electronics 與 K9HUGY8J5B-BCK0 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K9IUGY8J7B-BCK0 - 1Tb V-NAND TLC Flash | Samsung | Memory ICs
K9IUGY8J7B-BCK0 ✓ 啟用中規格比較
| 參數 | K9IUGY8J7B-BCK0 | K9HUGY8J5B-BCK0 |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| MPN | K9IUGY8J7B-BCK0 | — |
| Product Type | V-NAND Flash (raw NAND) | — |
| Density | 1 Tbit | [DATA_NEEDED: device density] |
| Cell Type | TLC (Triple-Level Cell, 3 bits/cell) | [DATA_NEEDED: SLC/MLC/TLC/QLC] |
| Technology | Samsung V-NAND (3D vertical NAND) | — |
| Speed Grade | BCK0 | — |
| 介面 | [DATA_NEEDED: interface type and data rate] | [DATA_NEEDED: asynchronous/toggle DDR] |
| 供應電壓 | [DATA_NEEDED: VCC range] | — |
| 組織 | [DATA_NEEDED: page/block organization] | [DATA_NEEDED: page/block organization] |
| Program/Erase Cycles | [DATA_NEEDED: P/E endurance] | — |
| Package Type | [DATA_NEEDED: package code / ball count] | — |
| 工作溫度 | [DATA_NEEDED: temperature range] | [DATA_NEEDED: temperature range] |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| 生命週期狀態 | Active | — |
| Product Family | — | K9HUG (V-NAND flash) |
| 記憶體類型 | — | NAND Flash (3D V-NAND) |
| Bus Width | — | [DATA_NEEDED: x8 or x16] |
| Supply Voltage (VCC) | — | [DATA_NEEDED: VCC range] |
| Supply Voltage (VCCQ) | — | [DATA_NEEDED: VCCQ range] |
| Page Program Time | — | [DATA_NEEDED: tPROG] |
| Page Read Time | — | [DATA_NEEDED: tR] |
| Block Erase Time | — | [DATA_NEEDED: tBERS] |
| Endurance | — | [DATA_NEEDED: P/E cycles] |
| 封裝 | — | [DATA_NEEDED: package code, e.g. FBGA] |