K9IUGY8J7B-BCK0 vs K9IUGY8J7B-CCK0 比較

詳細並排比較 K9IUGY8J7B-BCK0 由 Samsung Electronics 與 K9IUGY8J7B-CCK0 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9IUGY8J7B-BCK0 K9IUGY8J7B-BCK0 - 1Tb V-NAND TLC Flash | Samsung | Memory ICs

K9IUGY8J7B-BCK0 - 1Tb V-NAND TLC Flash | Samsung | Memory ICs

K9IUGY8J7B-BCK0 ✓ 啟用中
Samsung Electronics
K9IUGY8J7B-CCK0 K9IUGY8J7B-CCK0 - 1Tb 3D V-NAND TLC Flash | Samsung

K9IUGY8J7B-CCK0 - 1Tb 3D V-NAND TLC Flash | Samsung

K9IUGY8J7B-CCK0 ✓ 啟用中

規格比較

參數 K9IUGY8J7B-BCK0 K9IUGY8J7B-CCK0
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs EEPROM
生命週期狀態 啟用中 啟用中
Manufacturer Samsung Electronics Samsung Electronics
MPN K9IUGY8J7B-BCK0 —
Product Type V-NAND Flash (raw NAND) —
Density 1 Tbit —
Cell Type TLC (Triple-Level Cell, 3 bits/cell) TLC (3 bits per cell)
Technology Samsung V-NAND (3D vertical NAND) —
Speed Grade BCK0 —
介面 [DATA_NEEDED: interface type and data rate] —
供應電壓 [DATA_NEEDED: VCC range] —
組織 [DATA_NEEDED: page/block organization] —
Program/Erase Cycles [DATA_NEEDED: P/E endurance] [DATA_NEEDED: P/E cycle endurance]
Package Type [DATA_NEEDED: package code / ball count] [DATA_NEEDED: exact package code]
工作溫度 [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
生命週期狀態 Active —
Memory Density — 1 Tb (Tera bit)
記憶體類型 — NAND Flash, 3D V-NAND TLC
V-NAND Generation — V6 (6th generation)
Process Node / Layer Count — 4448-128L (128-layer)
介面類型 — [DATA_NEEDED: bus interface type]
Supply Voltage (VCC) — [DATA_NEEDED: VCC voltage]
Supply Voltage (VCCQ) — [DATA_NEEDED: VCCQ voltage]
資料匯流排寬度 — [DATA_NEEDED: data bus width]
Page Size — [DATA_NEEDED: page size]
Block Size — [DATA_NEEDED: block size]

資料表與資源

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