M1AFS250-1FGG256I vs M1AFS250-FG256 比較
詳細並排比較 M1AFS250-1FGG256I 由 Microchip Technology 與 M1AFS250-FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ 啟用中Microchip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ 啟用中規格比較
| 參數 | M1AFS250-1FGG256I | M1AFS250-FG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | M1AFS250 (Fusion) | M1AFS250 |
| System Gates | 250,000 gates | 250000 |
| Logic Cells | 6144 | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | 114 |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | — |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | — |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | Flash (nonvolatile) |
| Security | 128-bit flash-based lock, AES decryption | — |
| 工作電源電壓 | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| 封裝 / 外殼 | 256-LBGA (FBGA), 1.00 mm ball pitch | 256-FBGA (256-LBGA), 1.00 mm pitch |
| 安裝方式 | SMD/SMT | SMD/SMT |
| Packaging | Tray | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Manufacturer Part Number | — | M1AFS250-FG256 |
| Family | — | Fusion (M1 series, ARM Cortex-M1) |
| Embedded Processor | — | ARM Cortex-M1 |
| 最大時脈頻率 | — | 350 MHz |
| RAM Bits | — | 36864 |
| Process Technology | — | 130 nm |
| Core Supply Voltage | — | 1.5 V |
| 工作溫度範圍 | — | 0C to +70C |
| Lead Free Status | — | Contains Lead |