M1AFS250-2FG256I vs M1AFS600-2FG256 比較

詳細並排比較 M1AFS250-2FG256I 由 Microchip Technology 與 M1AFS600-2FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS250-2FG256I M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I ✓ 啟用中
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 啟用中

規格比較

參數 M1AFS250-2FG256I M1AFS600-2FG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion (M1AFS, ARM Cortex-M1 support) —
System Gates 250K 600000 gates
User I/O 114 —
Embedded RAM Bits 36864 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm, 7-layer metal flash-based CMOS —
System Performance 350 MHz —
Processor Core ARM Cortex-M1 (hard IP) —
Configuration Memory Flash-based, nonvolatile —
Power-Up Mode Live at Power-Up (LAPU) —
Analog Block Configurable analog (voltage, current, temperature monitoring) —
封裝 256-ball FBGA (256-LBGA) —
Speed Grade -2 —
Temperature Range Industrial (-40C to +85C) —
安裝類型 Surface Mount —
RoHS 狀態 RoHS Non-Compliant (contains lead; FGG variant is lead-free) [DATA_NEEDED: RoHS status]
Packaging Tray Tray
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Embedded Processor — ARM Cortex-M1
Number of I/Os — 119 I/O
Technology — 130 nm flash-based
封裝 / 外殼 — 256-LBGA (FBGA-256)
安裝方式 — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

資料表與資源

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