M29W320DB70N3F vs M29W320DT70N3F 比較

詳細並排比較 M29W320DB70N3F 由 Micron Technology 與 M29W320DT70N3F 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
M29W320DB70N3F M29W320DB70N3F - 32Mbit NOR Flash 70ns TSOP-48 | Micron

M29W320DB70N3F - 32Mbit NOR Flash 70ns TSOP-48 | Micron

M29W320DB70N3F ✓ 啟用中
Micron Technology
M29W320DT70N3F M29W320DT70N3F - 32Mbit NOR Flash 70ns TSOP-48 | Micron

M29W320DT70N3F - 32Mbit NOR Flash 70ns TSOP-48 | Micron

M29W320DT70N3F ✓ 啟用中

規格比較

參數 M29W320DB70N3F M29W320DT70N3F
品牌 Micron Technology Micron Technology
類別 Flash Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 NOR Flash FLASH - NOR
Technology Parallel NOR Flash —
Density 32 Mbit (33554 kbits) —
組織 2 M x 16 —
Bus Width x8/x16 selectable —
Access Time 70 ns —
Supply Voltage (VCC) 3.0 V to 3.6 V —
VPP Fast Program Voltage 12 V 12 V (optional)
Block Organization Non-uniform parameter blocks, boot block (DB = bottom boot block) —
工作溫度 -40C to +125C —
封裝 48-TSOP I, 12 x 20 mm —
安裝類型 Surface Mount Surface Mount
介面 Parallel Parallel (Byte-wide)
RoHS 狀態 Compliant —
Packaging Variant (TR) Tape & Reel available (M29W320DB70N3F TR) —
記憶體容量 — 32 Mbit (4M x 8, 2M x 16)
Access Speed — 70 ns
Supply Voltage - VCC — 2.7 V to 3.6 V
Boot Block Organization — Top boot block (DT suffix)
Block Architecture — Non-uniform parameter blocks
封裝 / 外殼 — 48-TFSOP (0.724 in, 18.40 mm width)
Packaging — Tape & Reel (TR suffix)
Temperature Grade — Automotive
Max Seated Height — 1.2 mm
Number of Terminals — 48
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
Write Cycle - Page Program Time — [DATA_NEEDED: page program time]

資料表與資源

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