M321R2GA3EB0-CWM vs M321R2GA3PB0-CWM 比較
詳細並排比較 M321R2GA3EB0-CWM 由 Samsung Electronics 與 M321R2GA3PB0-CWM 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | M321R2GA3EB0-CWM | M321R2GA3PB0-CWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | EEPROM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Capacity | 16 GB (2Gx72) | — |
| 記憶體類型 | DDR5 SDRAM | DDR5 SDRAM |
| Module Type | 288-pin ECC Registered DIMM (RDIMM) | 288-pin RDIMM (ECC Registered) |
| Speed | 5600 MT/s (PC5-44800) | 5600 Mbps (PC5-44800) |
| CAS 延遲 | CL46 | [DATA_NEEDED: CAS latency] |
| Operating Voltage | 1.1 V | 1.1 V |
| Rank / Organization | 1Rx8 (single rank, x8) | — |
| DRAM Configuration | 10 FBGA 2Gx8 DRAM devices | — |
| ECC | Yes (ECC Registered) | Registered with ECC |
| 腳位數 | 288 | — |
| Form Factor | DIMM (server RDIMM) | EC8 RDIMM |
| Application Class | Server / Data Center | — |
| Standard Compliance | JEDEC DDR5 RDIMM | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| 工作溫度 | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature] |
| Height | [DATA_NEEDED: module height] | — |
| Density | — | 16 GB (2G x 72) |
| Rank x Organization | — | 1R x 8 |
| Component Composition | — | (2G x 8) x 10 FBGA DRAM |
| 腳位數 | — | 288 |
| Product Status | — | Mass Production |
| Compatible Platforms | — | Servers and workstations with DDR5 RDIMM support (e.g. Dell PowerEdge R660) |