M7AFS600-2FG256 vs M7AFS600-FGG256I 比較
詳細並排比較 M7AFS600-2FG256 由 Microchip Technology 與 M7AFS600-FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-2FG256 - Fusion FPGA, ARM CoreMP7, 600K Gates | Microchip
M7AFS600-2FG256 ✓ 啟用中Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ 啟用中規格比較
| 參數 | M7AFS600-2FG256 | M7AFS600-FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Fusion (Actel/Microsemi/Microchip) | Fusion Mixed-Signal FPGA |
| System Gates | 600000 | 600K |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 |
| Total Logic Elements | [DATA_NEEDED: Total Logic Elements] | — |
| On-Chip Flash RAM | 110592 bit | — |
| Number of I/O | 119 | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage | [DATA_NEEDED: I/O Voltage] | — |
| Speed Grade | -2 | — |
| Process Technology | 130 nm | 130 nm |
| Configuration Memory | Flash (non-volatile, instant-on) | — |
| 封裝 | 256-LBGA (FG256), 17x17x1.7 mm | 256-LBGA (FBGA), 1 mm ball pitch |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| 工作溫度 | [DATA_NEEDED: Operating Temperature] | — |
| RoHS 狀態 | Compliant (RoHS Compliant: Yes per Newark) | — |
| User I/O | — | 119 |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| 工作溫度範圍 | — | -40C to +85C (industrial grade standard range) |
| MSL 等級 | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |