M7AFS600-FG256I vs A3P600-2FG256I 比較

詳細並排比較 M7AFS600-FG256I 由 Microchip Technology 與 A3P600-2FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 啟用中
Microchip Technology
A3P600-2FG256I A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip

A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip

A3P600-2FG256I ✓ 啟用中

規格比較

參數 M7AFS600-FG256I A3P600-2FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M7AFS600 (Fusion) —
System Gates 600K —
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm —
封裝 / 外殼 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安裝方式 SMD/SMT SMD/SMT
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Manufacturer Series — ProASIC3 (A3P600)
Logic Elements (LEs) — 7K LEs (approximately)
Configuration Memory — 110592 bits (flash, non-volatile)
Number of I/Os — 177 I/O
Speed Grade — -2
Temperature Range — -40C to +85C (industrial, suffix I)
封裝 — 256-FBGA (LBGA)
Configuration Technology — Flash (single-chip, no external PROM)
Reprogrammability — Yes (in-system reprogrammable)
Power-up Behavior — Live at power-up (instant-on)
I/O Banks — 4 I/O banks with dedicated VCCIBx supplies
Logic Architecture — VersaTile (3-input LUT / D-FF / latch with enable)
RoHS 狀態 — [DATA_NEEDED: RoHS Status]
Moisture Sensitivity Level — [DATA_NEEDED: MSL Level]

資料表與資源

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