M7AFS600-FG256I vs AFS600-FGG256I 比較

詳細並排比較 M7AFS600-FG256I 由 Microchip Technology 與 AFS600-FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 啟用中
Microchip Technology
AFS600-FGG256I AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I ✓ 啟用中

規格比較

參數 M7AFS600-FG256I AFS600-FGG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M7AFS600 (Fusion) —
System Gates 600K 600,000 gates
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
封裝 / 外殼 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安裝方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Device Type — Fusion mixed-signal FPGA
Metal Layers — 7 layers
Configuration Memory — Nonvolatile flash
Power-Up Configuration — Live at Power-Up (LAPU)
System Performance Frequency — 350 MHz
供應電壓 — 1.5 V
Logic Family — CMOS
Total Pin Count — 256 pins
Package Type — BGA-256
Package Pitch — 1.0 mm
Package Form — Square
Terminal Type — Ball
工作溫度 — 0°C to +70°C
Temperature Grade — Industrial
Programmable Analog Resources — Configurable analog blocks
Embedded Flash — Large flash memory blocks
Clock Management — Comprehensive clock generation and management circuitry
Programming Interface — [DATA_NEEDED: programming interface]
I/O Standards — [DATA_NEEDED: supported I/O standards]
Maximum I/O Current — [DATA_NEEDED: maximum I/O current]
Junction Temperature — [DATA_NEEDED: junction temperature rating]

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