M7AFS600-FGG256 vs AFS600-2FGG256 比較
詳細並排比較 M7AFS600-FGG256 由 Microchip Technology 與 AFS600-2FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ 啟用中
規格比較
| 參數 | M7AFS600-FGG256 | AFS600-2FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Fusion (M7AFS600) | — |
| System Gates | 600K | Approximately 600,000 gates |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Maximum Frequency | 1098.9 MHz (distributor listing) | — |
| 封裝 | 256-LBGA / 256-FBGA | 256-LBGA |
| Ball Pitch | 1 mm | — |
| 安裝類型 | Surface Mount | SMD/SMT |
| Configuration Memory | Flash (single-chip, non-volatile) | Nonvolatile flash |
| Analog Features | Integrated configurable analog blocks, clock generation and management | — |
| 工作溫度 | [DATA_NEEDED: Operating Temperature Range] | 0°C to +70°C |
| Packaging | Tray | Tray |
| RoHS 狀態 | [DATA_NEEDED: RoHS Status] | RoHS compliant |
| MSL 等級 | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Product Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| Reported Logic Elements | — | 7,000 LE |
| Number of I/O | — | 119 I/O |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| 工作電源電壓 | — | 1.5 V |
| Metal Layers | — | 7 layers |
| Power-Up Feature | — | Live at Power-Up |
| Maximum DDR Data Rate | — | 700 Mbps |
| I/O Features | — | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down |
| Lead-Free Status | — | Lead free |