M7AFS600-FGG256 vs M1AFS600-2FG256 比較

詳細並排比較 M7AFS600-FGG256 由 Microchip Technology 與 M1AFS600-2FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FGG256 M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 ✓ 啟用中
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ 啟用中

規格比較

參數 M7AFS600-FGG256 M1AFS600-2FG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion (M7AFS600) —
System Gates 600K 600000 gates
Flip-Flops 110592 —
User I/O 119 —
Embedded Processor ARM CoreMP7 ARM Cortex-M1
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm flash-based —
Maximum Frequency 1098.9 MHz (distributor listing) —
封裝 256-LBGA / 256-FBGA —
Ball Pitch 1 mm —
安裝類型 Surface Mount —
Configuration Memory Flash (single-chip, non-volatile) —
Analog Features Integrated configurable analog blocks, clock generation and management —
工作溫度 [DATA_NEEDED: Operating Temperature Range] —
Packaging Tray Tray
RoHS 狀態 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: Moisture Sensitivity Level] —
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Number of I/Os — 119 I/O
Technology — 130 nm flash-based
封裝 / 外殼 — 256-LBGA (FBGA-256)
安裝方式 — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

資料表與資源

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