M7AFS600-FGG256I vs AFS600-FG256I 比較

詳細並排比較 M7AFS600-FGG256I 由 Microchip Technology 與 AFS600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 啟用中
Microchip Technology
AFS600-FG256I AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I ✓ 啟用中

規格比較

參數 M7AFS600-FGG256I AFS600-FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600,000 gates
User I/O 119 119 I/O
封裝 256-LBGA (FBGA), 1 mm ball pitch —
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
工作溫度範圍 -40C to +85C (industrial grade standard range) —
安裝類型 Surface Mount Surface mount
Packaging Tray —
MSL 等級 [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Device Type — Fusion mixed-signal FPGA
Configurable Logic Blocks — 13,824 CLBs
供應電壓 — 1.5 V
Metal Layers — 7 layers
Configuration Memory — Nonvolatile flash memory
Power-Up Feature — Live at Power-Up (LAPU)
Logic Family — CMOS
Package Type — 256-LBGA
Package Pitch — 1.0 mm
Number of Package Balls — 256 balls
Package Shape — Square
工作溫度 — 0 C to 70 C
RoHS 狀態 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

資料表與資源

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