M7AFS600-FGG256I vs M1AFS600-1FGG256 比較

詳細並排比較 M7AFS600-FGG256I 由 Microchip Technology 與 M1AFS600-1FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 啟用中
Microchip Technology
M1AFS600-1FGG256 M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 ✓ 啟用中

規格比較

參數 M7AFS600-FGG256I M1AFS600-1FGG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion Mixed-Signal FPGA Fusion Mixed-Signal FPGA
System Gates 600K 600000
User I/O 119 119
封裝 256-LBGA (FBGA), 1 mm ball pitch 256-ball LBGA (FGG256), 17x17x1.7 mm
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm CMOS, flash-based
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) —
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
工作溫度範圍 -40C to +85C (industrial grade standard range) —
安裝類型 Surface Mount Surface Mount
Packaging Tray Tray
MSL 等級 [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Processor Core — ARM Cortex-M1 (hard core)
Configurable Logic Blocks (CLBs) — 13824
Flip-Flops — 110592
Core Supply Voltage — 1.5 V
Configuration Memory — Flash (non-volatile, live at power-up)
工作溫度 — 0C to +85C
Analog Features — Configurable analog blocks, clock generation and management
RoHS 狀態 — Compliant

資料表與資源

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