MC9RS08KB4CWJ vs MC9RS08KB8CTG 比較
詳細並排比較 MC9RS08KB4CWJ 由 NXP Semiconductors 與 MC9RS08KB8CTG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9RS08KB4CWJ | MC9RS08KB8CTG |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 啟用中 |
| Core Processor | RS08 | — |
| Core Size | 8-bit | — |
| CPU Speed | 20 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | 8 KB (8K x 8) Flash |
| RAM Size | 126 B | — |
| EEPROM Size | None (Flash-based) | — |
| Number of I/O | 18 | — |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.7 V to 5.5 V |
| Connectivity | I2C, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | ADC, Timers, Communication interfaces (per datasheet) |
| Instruction Set | HC08 subset + BGND | — |
| 封裝 | 20-pin SOIC (wide-body, tube) | 16-TSSOP (0.173", 4.40 mm width) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +85C | — |
| MSL 等級 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listings) |
| Debug Interface | Background Debug Mode (BDM) | RS08 background debug (BGND instruction) |
| 資料匯流排寬度 | 8-bit | 8 bit |
| Core | — | RS08 (subset of HC08 with BGND) |
| Maximum CPU Frequency | — | 20 MHz |
| 工作溫度範圍 | — | -40C to +85C |
| On-chip RAM | — | [DATA_NEEDED: RAM size] |
| On-chip EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Interrupt Structure | — | Single global interrupt vector |