MC9S08DN60ACLH vs S9S08DZ60F1CLH 比較

詳細並排比較 MC9S08DN60ACLH 由 NXP Semiconductors 與 S9S08DZ60F1CLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
S9S08DZ60F1CLH S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH Obsolete

規格比較

參數 MC9S08DN60ACLH S9S08DZ60F1CLH
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND Obsolete
Core HCS08 (S08 core) —
資料匯流排寬度 8 bit —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) [DATA_NEEDED: RAM size]
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 —
封裝 / 外殼 64-LQFP (10x10 mm) —
安裝類型 Surface Mount Surface Mount
ADC 16-channel, 12-bit, 2.5 us conversion 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet]
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External —
Interrupt Sources Up to 32 —
工作溫度 -40C to +85C [DATA_NEEDED: confirm automotive grade range] -40 C to +85 C (industrial) / -40 C to +125 C (automotive)
Packaging Tray —
RoHS 狀態 Compliant —
Instruction Set HC08 + BGND instruction —
On-Chip Debug BDM (Background Debug Mode) —
Core Processor — S08
Core Size — 8-bit
最大時脈頻率 — 40 MHz
Program Memory Size — 60 KB (60K x 8) Flash
EEPROM Size — 2 KB (2K x 8)
Supply Voltage (Vdd) — 2.7 V to 5.5 V
Number of I/O Pins — 53
封裝 — 64-LQFP (10x10 mm)
Connectivity — CAN, I2C, LIN, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Mask Set — M74K
生命週期狀態 — Obsolete (mask-only factory stock)
Lead-Free / RoHS — [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free]

資料表與資源

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