MC9S08DV60AMLH vs MC9S08DZ60ACLF 比較
詳細並排比較 MC9S08DV60AMLH 由 NXP Semiconductors 與 MC9S08DZ60ACLF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF Nrnd規格比較
| 參數 | MC9S08DV60AMLH | MC9S08DZ60ACLF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | — |
| Number of I/O | 53 | — |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | — |
| 供應電壓 | 3.3V/5V | — |
| 封裝 / 外殼 | 64-LQFP (10x10 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Instruction Set | HC08 with added BGND instruction | HC08 instruction set with added BGND instruction |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| LCD Driver | — | Yes (on-chip segment LCD driver) |
| 封裝 | — | 48-LQFP (7x7 mm) |
| 工作溫度 | — | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| MSL 等級 | — | MSL 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | — | Compliant |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |