MC9S08DZ60ACLF vs MC9S08DV60AMLH 比較
詳細並排比較 MC9S08DZ60ACLF 由 NXP Semiconductors 與 MC9S08DV60AMLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF Nrnd
規格比較
| 參數 | MC9S08DZ60ACLF | MC9S08DV60AMLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core | HCS08 (8-bit CISC) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1 x CAN 2.0 A/B | — |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | — |
| 封裝 | 48-LQFP (7x7 mm) | — |
| 工作溫度 | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | — |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | MSL 3 (per JEDEC J-STD-020) | — |
| RoHS 狀態 | Compliant | — |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 with added BGND instruction |
| Core Processor | — | S08 (HCS08), 8-bit |
| Core Size | — | 8-Bit |
| Speed | — | 40MHz CPU (20MHz bus) |
| Program Memory Size | — | 60KB (60K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 3K x 8 |
| Number of I/O | — | 53 |
| Input-Only Pins | — | 1 |
| ADC Resolution | — | 12-bit |
| ADC Channels | — | 16 |
| ADC Conversion Time | — | 2.5 us |
| Connectivity | — | CAN (MSCAN), LIN master |
| Oscillator Type | — | External |
| Interrupt/Reset Sources | — | Up to 32 |
| 供應電壓 | — | 3.3V/5V |
| 封裝 / 外殼 | — | 64-LQFP (10x10 mm) |
| Packaging | — | Tray |