MC9S08SE8VWL vs MC9S08AW60CFGE 比較

詳細並排比較 MC9S08SE8VWL 由 NXP Semiconductors 與 MC9S08AW60CFGE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08SE8VWL MC9S08SE8VWL - 8-Bit S08 MCU, 8KB Flash, 20MHz, 28-SOIC | NXP

MC9S08SE8VWL - 8-Bit S08 MCU, 8KB Flash, 20MHz, 28-SOIC | NXP

MC9S08SE8VWL ⚠ 最後購買機會
NXP Semiconductors
MC9S08AW60CFGE MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AW60CFGE Nrnd

規格比較

參數 MC9S08SE8VWL MC9S08AW60CFGE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 NRND
Core S08 (HCS08) 8-bit CISC —
Maximum CPU Frequency 20 MHz 40 MHz
Program Flash Memory 8 KB (8K x 8) —
RAM 1 KB —
EEPROM 512 bytes —
Operating Voltage 2.7 V to 5.5 V —
Supply Voltage (datasheet rating) 3.3 V / 5 V dual-rail —
ADC 8-channel, 12-bit (10-bit mode) —
Timers (TPM) 2 x 16-bit —
Communication Interfaces 1 x SCI (UART), 1 x SPI, 1 x I2C —
GPIO Up to 24 shared with peripherals —
封裝 28-SOIC (W, wide-body) 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2
安裝類型 Surface Mount Surface Mount
工作溫度 -40 C to +105 C (industrial) [DATA_NEEDED: operating temperature range]
Debug Interface Background Debug Mode (BDM), single-wire Single-wire background debug mode (BDM)
Low-Voltage Detect Yes (LVD module) —
RoHS 狀態 Compliant —
MSL 等級 MSL3 (JEDEC J-STD-020) —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-Bit
Internal Bus Frequency — 20 MHz
Flash Memory — 60 KB (60K x 8)
RAM Size — [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K)
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38 general-purpose I/O
ADC Resolution — 10-bit, 8-channel
Instruction Set — HC08 instruction set with added BGND instruction
Supply Voltage Nominal — 3.3 V / 5 V
Packaging — Tray
生命週期狀態 — NRND (Not Recommended for New Designs) per NXP
Family — MC9S08AW (S08AW series)

資料表與資源

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