MC9S08SH8MTGR vs MC9S08LL36CLK 比較

詳細並排比較 MC9S08SH8MTGR 由 NXP Semiconductors 與 MC9S08LL36CLK 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08SH8MTGR MC9S08SH8MTGR - 8-bit S08 MCU, 8KB Flash, 40MHz | NXP | TSSOP-16

MC9S08SH8MTGR - 8-bit S08 MCU, 8KB Flash, 40MHz | NXP | TSSOP-16

MC9S08SH8MTGR ✓ 啟用中
NXP Semiconductors
MC9S08LL36CLK MC9S08LL36CLK - S08 8-bit MCU, 36KB Flash, 40MHz | NXP

MC9S08LL36CLK - S08 8-bit MCU, 36KB Flash, 40MHz | NXP

MC9S08LL36CLK ✓ 啟用中

規格比較

參數 MC9S08SH8MTGR MC9S08LL36CLK
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Processor HCS08 (S08 core, 8-bit CISC) —
Core Size 8-bit —
Maximum CPU Frequency 40 MHz 40 MHz
Program Memory (Flash) 8 KB (8K x 8) —
RAM Size 512 x 8 (512 B) 4 KB (4K x 8)
EEPROM Size Not present (Flash-only) —
Operating Voltage Range 2.7 V to 5.5 V —
Number of I/O Pins 13 39
封裝 16-pin TSSOP (Tape and Reel) —
安裝類型 Surface Mount Surface Mount
Connectivity I2C, LINbus, SCI, SPI —
Peripherals LVD, POR, PWM, WDT, ACMP LCD driver, PWM, timers, ADC, BDM, watchdog
ADC 12-channel, 10-bit, 2.5 µs conversion —
Temperature Sensor Internal (ADC channel) —
Interrupt Sources Up to 32 —
Debug Interface BDM (Background Debug Mode) —
Lead-Free / RoHS Yes (per Mouser listing) —
工作溫度 [DATA_NEEDED: operating temperature range] -40 C to +85 C (industrial)
Manufacturer — NXP Semiconductors (Freescale)
Series — S08 / MC9S08LL
Core — HCS08, 8-bit
Program Memory Size — 36 KB (36K x 8) FLASH
Operating Voltage (full speed) — 2.1 V to 3.6 V
Operating Voltage (to 20 MHz) — 1.8 V to 3.6 V
Oscillator Type — Internal
封裝 / 外殼 — 80-LQFP (14 x 14 mm)
Programming Interface — Background Debug Mode (BDM)
Lead Free / RoHS Status — Compliant

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