MC9S12C64VFAE vs MC9S12GC64CFAE 比較

詳細並排比較 MC9S12C64VFAE 由 NXP Semiconductors 與 MC9S12GC64CFAE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12C64VFAE MC9S12C64VFAE - 16-Bit HCS12 MCU, 64KB Flash, LQFP-48 | NXP

MC9S12C64VFAE - 16-Bit HCS12 MCU, 64KB Flash, LQFP-48 | NXP

MC9S12C64VFAE Nrnd
NXP Semiconductors
MC9S12GC64CFAE MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP

MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP

MC9S12GC64CFAE Nrnd

規格比較

參數 MC9S12C64VFAE MC9S12GC64CFAE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core HCS12 —
資料匯流排寬度 16 bit —
Program Memory Size 64 KB Flash —
RAM Size 4 KB —
最大時脈頻率 25 MHz —
Supply Voltage Range 2.97 V to 5.5 V (external); internal Vreg generates core VDD —
I/O Pins 31 —
ADC 8/10-bit on-chip 10-bit, 8 channels
Communication Interfaces CAN 2.0 A/B, SCI (UART), SPI —
Timers 16-bit Enhanced Capture Timer (ECT) and others (per datasheet) TIM/PWM/Input-Capture/Output-Compare
On-chip Voltage Regulator Yes (bandgap-based) —
PLL Yes (phase-locked loop) On-chip (crystal-derived bus clock)
Debug Interface Background Debug Mode (BDM) Background Debug Mode (BDM)
封裝 48-pin LQFP (7x7 mm) 48-LQFP (7x7 mm)
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +105C -40C to +85C
RoHS 狀態 [DATA_NEEDED: RoHS compliance status not in provided data] Compliant
Core Architecture — HCS12 (16-bit)
Program Memory (Flash) — 64 KB (64K x 8)
RAM — 4 KB
EEPROM — 1 KB
Maximum CPU Frequency — 25 MHz
External Supply Range — 2.97 V to 5.5 V
Internal Voltage Regulator — On-chip bandgap-based Vreg
CAN Controller — CAN 2.0 A/B (1 module)
Serial Interfaces — SCI, SPI
MSL 等級 — [DATA_NEEDED: MSL Level]

資料表與資源

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