MC9S12D64MFUER vs MC9S12D64CFUE 比較
詳細並排比較 MC9S12D64MFUER 由 NXP Semiconductors 與 MC9S12D64CFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER Nrnd
規格比較
| 參數 | MC9S12D64MFUER | MC9S12D64CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Core | S12 CPU V2 | — |
| Operating Frequency | 25 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 64 KB (64K x 8) | — |
| 封裝 | 80-QFP (14 x 14 mm), also called PQFP-80 | 80-QFP (14 x 14 mm) |
| 安裝類型 | Surface Mount (SMD/SMT) | Surface Mount |
| 供應電壓 | 2.5 V / 5 V | 2.5 V / 5 V |
| Number of I/O | 59 | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 ADC channels total) | 8-channel, 10-bit |
| PWM Channels | 8 channels | — |
| Capture/Compare Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC | — |
| 工作溫度範圍 | -40 C to +125 C | — |
| Automotive Qualification | AEC-Q100 | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Packaging Method (tray / reel) | Tray | — |
| Approximate Weight | 0.033 oz (per supplier catalog) | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Watchdog / COP | Yes (COP reset, watchdog timer) | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| RAM | — | 4 KB |
| EEPROM | — | 1 KB |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| Timers | — | ECT, TIM, PWM, PIT |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |