MC9S12DG256CMPV vs MC9S12A256CFUE 比較
詳細並排比較 MC9S12DG256CMPV 由 NXP Semiconductors 與 MC9S12A256CFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
MC9S12DG256CMPV ✓ 啟用中
規格比較
| 參數 | MC9S12DG256CMPV | MC9S12A256CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core | HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) | — |
| Maximum CPU Clock | 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Operating Voltage | 2.5 V / 5 V (single supply with on-chip regulator) | — |
| I/O Voltage | 5 V tolerant | — |
| ADC | 10-bit, 8 channels | — |
| CAN Modules (MSCAN) | 1 x MSCAN 2.0A/B-compatible | — |
| SCI / SPI | 2 x SCI, 1 x SPI | — |
| Timers | Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI | — |
| BDLC (J1850) | 1 module (VPW) | — |
| 封裝 | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | 80-QFP (14x14 mm) |
| 腳位數 | 112 | — |
| 工作溫度 | -40 C to +85 C (automotive AEC-Q100) | -40C to +85C |
| AEC-Q100 Qualification | Qualified (automotive grade) | — |
| 安裝類型 | Surface Mount (gull-wing) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status - not present in verified snippet] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | HCS12 16-bit CISC |
| Bus Frequency | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| 供應電壓 | — | 2.5 V / 5 V (per Arrow listing) |
| Application Segment | — | Automotive (per Arrow listing) |
| Core Series | — | S12A (Barracuda, MOS13 per Mouser) |
| ADC Resolution | — | 10-bit |
| 資料匯流排寬度 | — | 16-bit |
| Programming Interface | — | BDM (Background Debug Mode) |
| RAM Size | — | [DATA_NEEDED: on-chip RAM size] |
| EEPROM Size | — | [DATA_NEEDED: on-chip EEPROM size] |
| CAN Channels | — | [DATA_NEEDED: number of CAN modules] |