MC9S12DG256CMPV vs MC9S12DP512MPVE 比較

詳細並排比較 MC9S12DG256CMPV 由 NXP Semiconductors 與 MC9S12DP512MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12DG256CMPV MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP

MC9S12DG256CMPV ✓ 啟用中
NXP Semiconductors
MC9S12DP512MPVE MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE ✓ 啟用中

規格比較

參數 MC9S12DG256CMPV MC9S12DP512MPVE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core HCS12 CPU12 (CISC, 16-bit, upward-compatible with HC11) —
Maximum CPU Clock 25 MHz (50 MHz effective instruction throughput via look-ahead fetch) —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 12 KB —
EEPROM 4 KB —
Operating Voltage 2.5 V / 5 V (single supply with on-chip regulator) —
I/O Voltage 5 V tolerant —
ADC 10-bit, 8 channels —
CAN Modules (MSCAN) 1 x MSCAN 2.0A/B-compatible —
SCI / SPI 2 x SCI, 1 x SPI —
Timers Enhanced Capture Timer (ECT), 8 x PWM, 1 x RTI 8-channel enhanced capture timer (IC/OC)
BDLC (J1850) 1 module (VPW) —
封裝 112-LQFP (20 x 20 mm, 0.65 mm pitch) 112-LQFP (20x20 mm)
腳位數 112 —
工作溫度 -40 C to +85 C (automotive AEC-Q100) [DATA_NEEDED: operating temperature range]
AEC-Q100 Qualification Qualified (automotive grade) —
安裝類型 Surface Mount (gull-wing) Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status - not present in verified snippet] —
Core Processor — HCS12 (CPU12), 16-bit CISC
Core Size — 16-bit
最大時脈頻率 — 25 MHz
Program Memory Size — 512 KB (512K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O — 91 general-purpose I/O
ADC Resolution — 10-bit
Number of ADC Channels — 16 (two 8-channel 10-bit ADCs)
Serial Interfaces — 2x SCI (asynchronous serial), IIC, SPI
PWM Channels — 8-channel pulse-width modulator
Program Memory Type — FLASH (0.25 um)
供應電壓 — [DATA_NEEDED: supply voltage range]
生命週期狀態 — Active

資料表與資源

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