MC9S12KT256MPVE vs MC9S12DT256MPVE 比較
詳細並排比較 MC9S12KT256MPVE 由 NXP Semiconductors 與 MC9S12DT256MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE Nrnd規格比較
| 參數 | MC9S12KT256MPVE | MC9S12DT256MPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Series | HCS12 | — |
| Core Processor | HCS12 (CPU12, 16-bit) | — |
| Core Size | 16-Bit | — |
| Speed | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB | — |
| Number of I/O | 91 | — |
| Oscillator Type | Internal | — |
| Connectivity | CAN, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT, ADC, IC/OC timer | — |
| ADC | 2 x 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| 供應電壓 | 2.5 V / 3.3 V / 5 V | 2.35 V to 2.75 V (regulated core) |
| 封裝 / 外殼 | 112-LQFP (20 x 20 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperature Grade | Automotive grade | — |
| RoHS 狀態 | Compliant | Compliant |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| 資料匯流排寬度 | — | 16-bit |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| 封裝 | — | 112-LQFP (20x20 mm) |
| 工作溫度 | — | -40C to +125C (automotive grade) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |
| 生命週期狀態 | — | NRND (Not Recommended for New Designs) |