MC9S12XDT256VAL vs MC9S12XDT256CAG 比較

詳細並排比較 MC9S12XDT256VAL 由 NXP Semiconductors 與 MC9S12XDT256CAG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XDT256VAL MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP

MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP

MC9S12XDT256VAL Nrnd
NXP Semiconductors
MC9S12XDT256CAG MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG ⚠ 最後購買機會

規格比較

參數 MC9S12XDT256VAL MC9S12XDT256CAG
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 最後購買
Product Type 16-bit Microcontroller (MCU) —
Core Architecture HCS12X (enhanced HCS12) with XGATE co-processor —
CPU Instruction Set CISC, upward-compatible with HCS12 —
Maximum CPU Frequency 80 MHz 80 MHz
Program Memory (Flash) 256 KB (256K x 8) —
Data Memory (RAM) [DATA_NEEDED: RAM size, datasheet shows 16 KB] —
EEPROM 4 KB 4 KB
ADC 16-channel, 10-bit 16-channel, 10-bit
CAN Controllers (msCAN) [DATA_NEEDED: msCAN count] —
General-Purpose I/O Up to 91 GPIO —
PWM Channels 8 channels 8
Supply Voltage - Core 2.5 V 2.35 V to 2.75 V
Supply Voltage - I/O 5 V 4.5 V to 5.5 V
工作溫度 -40C to +105C (VAL = Automotive grade) -40C to +85C
封裝 112-LQFP (20 x 20 mm) 144-pin LQFP (20x20 mm)
安裝類型 Surface Mount Surface Mount
MSL 等級 3 [DATA_NEEDED: MSL level]
Debug Interface Background Debug Mode (BDM) BDM (Background Debug Mode)
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
生命週期狀態 NRND (Not Recommended for New Designs) No Longer Manufactured (per NXP product page)
Core — HCS12X (16-bit CISC with XGATE co-processor)
Program Memory — 256 KB Flash
RAM — 16 KB
I/O Pins — 119
CAN Controllers (MSCAN) — 5 (CAN 2.0 A/B)
SCI / SPI — Yes
Timers — ECT (Enhanced Capture Timer)

資料表與資源

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