MCF5274LVF166 vs MCF5274LCVM166 比較

詳細並排比較 MCF5274LVF166 由 NXP Semiconductors 與 MCF5274LCVM166 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5274LCVM166 MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP

MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP

MCF5274LCVM166 Nrnd

規格比較

參數 MCF5274LVF166 MCF5274LCVM166
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Manufacturer NXP USA Inc. —
Series MCF527x —
Core Processor ColdFire V2 (MCF5xxx) —
Core Size 32-Bit —
Speed 166 MHz —
Program Memory Type ROMless —
封裝 / 外殼 196-LBGA / 196-MAPBGA (15x15 mm) —
供應電壓 2.5 V (core) / 3.3 V (I/O) —
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: exact operating temperature range]
Connectivity 10/100 Ethernet MAC, USB 2.0 Full-Speed, UART, I2C, SPI —
Peripherals DMA, Timers, PWM, Hardware Cryptographic Accelerator (AES/DES/SHA) —
Number of I/O [DATA_NEEDED: number of I/O lines] —
安裝類型 Surface Mount Surface Mount (BGA)
MSL 等級 3 (168 Hours) —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant (per distributor listing)
HTSUS 8542.31.0001 —
Core — ColdFire V2 (MCF527x family)
Core Architecture — 32-bit RISC (ColdFire)
Maximum Core Frequency — 166 MHz
Core Supply Voltage — 1.5 V
I/O Supply Voltage — 3.3 V
Program Memory — ROMless (external boot)
RAM — [DATA_NEEDED: internal SRAM size]
封裝 — 196-LBGA (15x15 mm)
Temperature Grade — Industrial
Ethernet — 10/100 Fast Ethernet MAC (integrated PHY on selected family members)
USB — USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members)
Cryptography — Hardware crypto accelerator (DES / 3DES / AES / SHA-1)
External Memory Bus — SDRAM / SRAM / ROM controller
DMA Channels — [DATA_NEEDED: number of DMA channels]
Serial Peripherals — UART, I2C, QSPI

資料表與資源

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