MCF54455VR266 vs MCF54453VR266 比較

詳細並排比較 MCF54455VR266 由 NXP Semiconductors 與 MCF54453VR266 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF54455VR266 MCF54455VR266 - Coldfire V4 32-Bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54455VR266 - Coldfire V4 32-Bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54455VR266 ⚠ 最後購買機會
NXP Semiconductors
MCF54453VR266 MCF54453VR266 - ColdFire V4 32-bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54453VR266 - ColdFire V4 32-bit MPU, 266MHz, 360-TEPBGA | NXP

MCF54453VR266 ✗ 停產

規格比較

參數 MCF54455VR266 MCF54453VR266
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 停產終止
Core Architecture ColdFire V4 (32-bit RISC, MMU) —
Core Frequency 266 MHz —
Instruction Set Width 32-bit —
On-chip Program Memory ROMless (external boot required) —
On-chip SRAM [DATA_NEEDED: internal SRAM size in KB] —
External Memory Bus 32-bit address/data; SDRAM/DDR, SRAM, NOR flash —
Supply Voltage (Core/IO) 1.8 V / 2.5 V / 3.3 V (mixed) —
Ethernet 10/100 MAC (eNet) Dual 10/100 MAC with MII/RMII
USB USB 2.0 On-The-Go (USB OTG) USB 2.0 On-The-Go with integrated PHY
PCI PCI v2.3 bus controller —
Serial Connectivity UART, I2C, SPI, SSI/I2S, FlexCAN —
MMU Yes (supports protected OS / Linux) Yes (full virtual memory)
工作溫度 0C to +70C (industrial grade variants may exist) —
封裝 360-TEPBGA (23x23 mm) 360-TEPBGA (23x23 mm)
安裝類型 Surface Mount, BGA Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant per NXP product page Compliant
Core — ColdFire V4
Architecture — 32-bit RISC (variable-length ColdFire ISA)
最大時脈頻率 — 266 MHz
Program Memory — ROMless (external flash required)
Terminal Form — BALL
Number of Terminals — 360
Temperature Grade — COMMERCIAL
Operating Voltage — 1.8V core / 2.5V / 3.3V I/O
Bus Interface — PCI 2.3 (32-bit), external memory bus (SDRAM/SRAM/Flash)

資料表與資源

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