MD7IC2250NBR1 vs MD7IC2250NR1 比較
詳細並排比較 MD7IC2250NBR1 由 NXP Semiconductors 與 MD7IC2250NR1 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MD7IC2250NBR1 - 5.3W W-CDMA RF LDMOS Amplifier | NXP Semiconductors
MD7IC2250NBR1 ✓ 啟用中規格比較
| 參數 | MD7IC2250NBR1 | MD7IC2250NR1 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | RF Amplifiers | RF Amplifiers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Part Family | MD7IC2250N | — |
| Description | Single W-CDMA RF LDMOS wideband integrated power amplifier | — |
| Frequency Range (Specified) | 2110-2170 MHz | — |
| Frequency Range (Usable) | 2000-2200 MHz | — |
| Output Power (Average, W-CDMA) | 5.3 W | — |
| Power Gain | 31 dB | 31 dB |
| Supply Voltage Range | 24 V to 32 V | — |
| Typical Supply Voltage | 28 V | — |
| Maximum Supply Voltage | 32 V | — |
| Technology | RF LDMOS (multi-stage integrated) | RF LDMOS (HV7IC) |
| 封裝 / 外殼 | TO-272 WB-14 (plastic over-mold) | TO-270-14 Variant, Flat Leads (TO-270 WB-14 GULL) |
| Number of Terminals | 14 | — |
| Terminal Form | Through-Hole (flat leads) | — |
| Package Body Material | Plastic / Epoxy | — |
| JEDEC Package Code (JESD-30) | R-PDFM-T14 | — |
| 安裝類型 | Through-Hole flange with thermal pad | Surface Mount (gull-wing leads + flange) |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| 工作溫度範圍 | [DATA_NEEDED: operating temperature range] | — |
| Datasheet Document | NXP MD7IC2250N datasheet (RF LDMOS Wideband Integrated Power Amplifiers) | — |
| Frequency Range | — | 2.0 GHz to 2.2 GHz |
| Operating Frequency (W-CDMA spec) | — | 2110 MHz to 2170 MHz |
| Supply Voltage (Vdd) | — | 28 V typ, 32 V max |
| Average Output Power (W-CDMA) | — | 5.3 W |
| 腳位數 | — | 15 (14 functional + flange) |
| MSL 等級 | — | 3 |
| Input Matching | — | Internal (on-chip) |
| Output Matching | — | Internal (on-chip) |
| Operating Mode | — | Class AB (W-CDMA linear) |
| Lead-Free | — | Yes |