MK50DN512CLQ10 vs MK50DX256ZCLQ10 比較

詳細並排比較 MK50DN512CLQ10 由 NXP Semiconductors 與 MK50DX256ZCLQ10 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MK50DN512CLQ10 MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP

MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP

MK50DN512CLQ10 ✓ 啟用中

規格比較

參數 MK50DN512CLQ10 MK50DX256ZCLQ10
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Architecture ARM Cortex-M4 with FPU and DSP —
Maximum CPU Frequency 100 MHz 100 MHz
Dhrystone Performance 1.25 MIPS per MHz —
Program Flash Memory 512 KB —
SRAM 128 KB 64 KB
Supply Voltage Range 1.71 V to 3.6 V —
工作溫度範圍 -40 C to +85 C (industrial) —
GPIO Count 96 I/O —
USB Controller USB 2.0 Full-Speed, on-chip transceiver —
ADC Channels [DATA_NEEDED: number of ADC channels] —
ADC Resolution Dual 16-bit SAR with up to 24-bit effective via oversampling —
DAC Resolution 12-bit —
Integrated Amplifiers Operational amplifiers and trans-impedance amplifiers —
封裝 144-pin LQFP (20 x 20 mm) 144-LQFP
安裝類型 Surface Mount Surface Mount
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant —
Lead-Free Yes —
Architecture — 32-bit ARM Cortex-M4
Flash Memory — 256 KB
Product Type — ARM Microcontroller - MCU
Series — Kinetis K50
Operating Voltage Variants — 1.8 V / 2.5 V / 3.3 V
USB Support — Full-Speed USB
Integrated Security — Security features specified in product information
Analog Measurement Engine — Integrated operational amplifiers and trans-impedance amplifiers
ADC — High-resolution ADC module specified in family description
DAC — DAC module specified in family description
Package Dimensions — 20 mm x 20 mm
Terminal Finish — Matte Tin (Sn)
Moisture Sensitivity Level — MSL 3
Peak Reflow Temperature — 260 C
Maximum Time At Peak Reflow Temperature — 40 s
生命週期狀態 — NRND
RoHS — [DATA_NEEDED: RoHS status]
REACH — [DATA_NEEDED: REACH status]
AEC-Q100 — [DATA_NEEDED: AEC-Q100 qualification]

資料表與資源

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