MPC8245LZU266D vs MPC8245LZU350D 比較
詳細並排比較 MPC8245LZU266D 由 NXP Semiconductors 與 MPC8245LZU350D 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC8245LZU266D | MPC8245LZU350D |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | MPC82xx | MPC82xx |
| Part Status | Active | — |
| Core Processor | PowerPC 603e | PowerPC 603e |
| Number of Cores / Bus Width | 1 Core / 32-bit | — |
| Speed (Clock Frequency) | 266 MHz | — |
| Performance | 505.4 MIPS | 665 MIPS |
| Co-Processor / DSP | None | — |
| RAM Controllers | SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED: display controller details] | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet?] | — |
| PCI Interface | 32-bit, 33/66 MHz | — |
| Memory Controller Max Frequency | 133 MHz (SDRAM), up to 2 GB | — |
| Serial I/O | I2C, UART, I2O | — |
| 供應電壓 | 3.3 V (typ.) | — |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| 工作溫度 | 0 C to +105 C (commercial) | 0C to +105C |
| 封裝 | 352-TBGA (35 mm x 35 mm) | 352-TBGA (35x35 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Tray Quantity | [DATA_NEEDED: tray qty per manufacturer packing] | — |
| RoHS 狀態 | [DATA_NEEDED: confirm per lot] | Non-Compliant (legacy) |
| Lead-Free Status | Lead-free (BGA balls, SnAgCu) | — |
| Core Architecture | — | Power Architecture (32-bit) |
| Number of Cores | — | 1 |
| 資料匯流排寬度 | — | 32 bit |
| 最大時脈頻率 | — | 350 MHz |
| Operating Voltage (Core/I/O) | — | 3.3 V |
| Integrated Bridge | — | PCI Bridge (up to 66 MHz) |
| L1 Cache (I/D) | — | 16 KB / 16 KB |
| Memory Controller | — | SDRAM with ECC support |