MPC8313CZQADDC vs MPC8313ZQADDC 比較

詳細並排比較 MPC8313CZQADDC 由 NXP Semiconductors 與 MPC8313ZQADDC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8313CZQADDC MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI

MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI

MPC8313CZQADDC ✓ 啟用中
NXP Semiconductors
MPC8313ZQADDC MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC ✓ 啟用中

規格比較

參數 MPC8313CZQADDC MPC8313ZQADDC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Series PowerQUICC II Pro, MPC83xx MPC83xx PowerQUICC II Pro
Core Architecture PowerPC e300c3 PowerPC e300c3
Core Count 1 1
資料匯流排寬度 32-Bit 32-bit
Maximum Core Frequency 267 MHz —
Package Type 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm)
工作溫度範圍 -40C to +105C —
供應電壓 1.8 V / 2.5 V / 3.3 V —
Memory Controller DDR1/DDR2 SDRAM with ECC —
Ethernet MACs 2x 10/100/1000 Mbps (GMII/TBI/RGMII, GMII/MII/RGMII) —
PCI Controllers 2x PCI / PCI-X —
USB Interface USB 2.0 Host + Device USB 2.0 High-Speed (Host/Device)
Local Bus 16-bit, up to 133 MHz —
Security Engine Integrated (IPsec / bulk crypto) AES / DES / 3DES
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant (Lead-Free) [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors / Freescale
Max Core Frequency — 267 MHz
Process Technology — 0.09 µm CMOS
Operating Voltage (Core) — 1.8 V
Operating Voltage (DDR I/O) — 2.5 V / 1.8 V
Operating Voltage (Standard I/O) — 3.3 V
工作溫度 — 0 °C to +105 °C
Ball Count — 516
Integrated Memory Controller — DDR1/DDR2 up to 266 MHz
Integrated Ethernet — 10/100/1000 Mbps (3x eTSEC)
PCI Interface — PCI 32-bit/66 MHz + mini-PCI
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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