MPC8313CZQAFFB vs MPC8313EVRAFFB 比較

詳細並排比較 MPC8313CZQAFFB 由 NXP Semiconductors 與 MPC8313EVRAFFB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8313CZQAFFB MPC8313CZQAFFB - PowerQUICC II Pro MPU, 333MHz, 516-TEPBGA | NXP

MPC8313CZQAFFB - PowerQUICC II Pro MPU, 333MHz, 516-TEPBGA | NXP

MPC8313CZQAFFB ✓ 啟用中
NXP Semiconductors
MPC8313EVRAFFB MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB ✓ 啟用中

規格比較

參數 MPC8313CZQAFFB MPC8313EVRAFFB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP USA Inc. NXP Semiconductors (formerly Freescale)
Series PowerQUICC II Pro (MPC83xx) —
Core Architecture PowerPC e300c3 PowerPC e300c3
Core Count 1 1
資料匯流排寬度 32-Bit 32-bit
最大時脈頻率 333 MHz —
Process Technology 0.09 um CMOS —
L1 Instruction Cache 16 KB —
L1 Data Cache 8 KB —
Operating Voltage 1.8 V / 2.5 V / 3.3 V —
Memory Controller DDR1/DDR2 up to 333 MHz DDR1/DDR2 (up to 256 MB addressable)
Ethernet Dual 10/100/1000 Mbps (SGMII/TBI) —
PCI Express 1 lane [DATA_NEEDED: PCIe lane count]
USB USB 2.0 with integrated PHY —
Encryption Accelerator Not included (Rev 2.1 W/O ENCR) —
封裝 516-TEPBGA (27 x 27 mm) —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant (lead-free TEPBGA) —
Part Status — Active
Processor Series — MPC83xx (PowerQUICC II Pro)
Maximum CPU Frequency — 333 MHz
Package Type — 516-TEPBGA (27 mm x 27 mm) with exposed die pad
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
Encryption Engine — Yes (AES, DES, 3DES, IPsec)
Ethernet Controllers — [DATA_NEEDED: ethernet port count and speed]
USB Interface — [DATA_NEEDED: USB revision]
RoHS — Details per manufacturer (status not confirmed by web data snippet)
Supplier Device Package — 516-TEPBGA

資料表與資源

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