MPC8313ZQADDC vs MPC8313CZQADDC 比較

詳細並排比較 MPC8313ZQADDC 由 NXP Semiconductors 與 MPC8313CZQADDC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8313ZQADDC MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC ✓ 啟用中
NXP Semiconductors
MPC8313CZQADDC MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI

MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI

MPC8313CZQADDC ✓ 啟用中

規格比較

參數 MPC8313ZQADDC MPC8313CZQADDC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors / Freescale —
Series MPC83xx PowerQUICC II Pro PowerQUICC II Pro, MPC83xx
Core Architecture PowerPC e300c3 PowerPC e300c3
Core Count 1 1
資料匯流排寬度 32-bit 32-Bit
Max Core Frequency 267 MHz —
Process Technology 0.09 µm CMOS —
Operating Voltage (Core) 1.8 V —
Operating Voltage (DDR I/O) 2.5 V / 1.8 V —
Operating Voltage (Standard I/O) 3.3 V —
工作溫度 0 °C to +105 °C —
Package Type 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm)
Ball Count 516 —
Integrated Memory Controller DDR1/DDR2 up to 266 MHz —
Integrated Ethernet 10/100/1000 Mbps (3x eTSEC) —
USB Interface USB 2.0 High-Speed (Host/Device) USB 2.0 Host + Device
PCI Interface PCI 32-bit/66 MHz + mini-PCI —
Security Engine AES / DES / 3DES Integrated (IPsec / bulk crypto)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant (Lead-Free)
Maximum Core Frequency — 267 MHz
工作溫度範圍 — -40C to +105C
供應電壓 — 1.8 V / 2.5 V / 3.3 V
Memory Controller — DDR1/DDR2 SDRAM with ECC
Ethernet MACs — 2x 10/100/1000 Mbps (GMII/TBI/RGMII, GMII/MII/RGMII)
PCI Controllers — 2x PCI / PCI-X
Local Bus — 16-bit, up to 133 MHz

資料表與資源

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