MPC8313ZQADDC vs MPC8313ZQADDB 比較

詳細並排比較 MPC8313ZQADDC 由 NXP Semiconductors 與 MPC8313ZQADDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8313ZQADDC MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC ✓ 啟用中
NXP Semiconductors
MPC8313ZQADDB MPC8313ZQADDB - PowerPC e300c3 MPU 267MHz 516-TEPBGA | NXP

MPC8313ZQADDB - PowerPC e300c3 MPU 267MHz 516-TEPBGA | NXP

MPC8313ZQADDB ✓ 啟用中

規格比較

參數 MPC8313ZQADDC MPC8313ZQADDB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors / Freescale NXP Semiconductors (formerly Freescale)
Series MPC83xx PowerQUICC II Pro MPC83xx
Core Architecture PowerPC e300c3 —
Core Count 1 —
資料匯流排寬度 32-bit 32-bit
Max Core Frequency 267 MHz —
Process Technology 0.09 µm CMOS —
Operating Voltage (Core) 1.8 V —
Operating Voltage (DDR I/O) 2.5 V / 1.8 V —
Operating Voltage (Standard I/O) 3.3 V —
工作溫度 0 °C to +105 °C [DATA_NEEDED: Operating temperature range]
Package Type 516-TEPBGA (27x27 mm) —
Ball Count 516 —
Integrated Memory Controller DDR1/DDR2 up to 266 MHz —
Integrated Ethernet 10/100/1000 Mbps (3x eTSEC) —
USB Interface USB 2.0 High-Speed (Host/Device) —
PCI Interface PCI 32-bit/66 MHz + mini-PCI —
Security Engine AES / DES / 3DES —
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
Core — PowerPC e300c3
Number of Cores — 1
最大時脈頻率 — 267 MHz
封裝 / 外殼 — 516-TEPBGA (27x27 mm)
Encryption — Without Encryption (W/O ENCR)
Revision — REV 2.1
Memory Controller — Integrated DDR/DDR2
Ethernet — Dual Gigabit Ethernet MACs
PCI Express — Yes (integrated)
USB — USB 2.0 (integrated)

資料表與資源

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