MPC8343ECZQAGDB vs MPC8347EVRAGDB 比較

詳細並排比較 MPC8343ECZQAGDB 由 NXP Semiconductors 與 MPC8347EVRAGDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8343ECZQAGDB MPC8343ECZQAGDB - 400MHz PowerQUICC II Pro SoC | NXP

MPC8343ECZQAGDB - 400MHz PowerQUICC II Pro SoC | NXP

MPC8343ECZQAGDB ⚠ 最後購買機會
NXP Semiconductors
MPC8347EVRAGDB MPC8347EVRAGDB - PowerQUICC II Pro e300 SoC 400MHz 620-HBGA | NXP

MPC8347EVRAGDB - PowerQUICC II Pro e300 SoC 400MHz 620-HBGA | NXP

MPC8347EVRAGDB ⚠ 最後購買機會

規格比較

參數 MPC8343ECZQAGDB MPC8347EVRAGDB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 最後購買
Core Architecture Power Architecture (e300), 32-bit Power Architecture e300 (32-bit)
Core Frequency 400 MHz 400 MHz
Instruction Set PowerPC compliant 32-bit Power Architecture
Process Technology 0.13 μm CMOS 0.13 micron CMOS
Operating Voltage 1.8 V / 2.5 V / 3.3 V —
Memory Controller DDR1 / DDR2 with ECC DDR1/DDR2 with ECC
Ethernet 1 x 10/100/1000 MAC (GbE) Dual 10/100/1000 Mbps (GMII/RGMII/TBI)
PCI Interface 32-bit, 66 MHz —
USB USB 2.0 full-speed host/device USB 2.0 Hi-Speed (480 Mbps), host/device/OTG
Security Engine SEC 2.0 (IPsec/SSL acceleration) SEC 2.0 (DES/3DES/AES/SHA-1/MD-5)
DMA Channels 4 —
封裝 620-PBGA (29 x 29 mm) 620-HBGA (29x29 mm, 1 mm pitch)
工作溫度 -40 °C to +105 °C (industrial) 0C to +105C (industrial)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant per NXP product page Compliant
Core Count — 1
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 256 KB unified
PCI — Dual PCI 2.3 interfaces
Serial I/O — 4x UART, 2x I2C, SPI
Supply Voltages — 1.8 V core / 2.5 V DDR / 3.3 V I/O
Product Family — PowerQUICC II Pro (MPC83xx)
生命週期狀態 — End of Life (Last Time Buy)

資料表與資源

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