MPC860DPZQ66D4 vs MPC860DPZQ80D4 比較

詳細並排比較 MPC860DPZQ66D4 由 NXP Semiconductors 與 MPC860DPZQ80D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860DPZQ66D4 MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 ⚠ 最後購買機會
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

規格比較

參數 MPC860DPZQ66D4 MPC860DPZQ80D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 Obsolete
Processor Type MPC8xx PowerQUICC 32-Bit RISC MPU MPC8xx PowerQUICC, 32-bit RISC MPU
Core 1 Core, 32-Bit PowerPC —
Operating Frequency 66 MHz —
Core / I/O Voltage 3.3 V —
L1 Instruction Cache 4 Kbyte —
L1 Data Cache 4 Kbyte —
On-chip RAM (per data sheet) [DATA_NEEDED: internal SRAM size] —
Co-Processor / DSP Communications Processor Module (CPM) —
Ethernet 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) —
DRAM Controller Yes, up to 256 Mbyte addressable —
Address Bus Width 32-Bit —
封裝 / 外殼 357-Ball PBGA, 25 x 25 mm 357-PBGA (25x25 mm)
Packaging Tray Tray
Lead-Free Status Contains Lead —
RoHS 狀態 Non-RoHS (legacy BGA, contains lead) Non-Compliant
工作溫度 0C to +70C (commercial grade) [DATA_NEEDED: operating temperature range]
Part Status Not For New Designs —
Core Architecture — PowerPC 603-class single core
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Process Technology — 0.32 um CMOS
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Serial Management Controllers (SMC) — 2 channels (UART/SPI/I2C)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
安裝類型 — Surface Mount
Lead Status — Contains Lead
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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