MPC860DPZQ80D4 vs MPC860TZQ80D4 比較

詳細並排比較 MPC860DPZQ80D4 由 NXP Semiconductors 與 MPC860TZQ80D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete
NXP Semiconductors
MPC860TZQ80D4 MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 ✗ 停產

規格比較

參數 MPC860DPZQ80D4 MPC860TZQ80D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 Obsolete 停產終止
Processor Type MPC8xx PowerQUICC, 32-bit RISC MPU MPC8xx PowerQUICC, 32-Bit
Core Architecture PowerPC 603-class single core PowerPC 32-bit
Maximum Core Clock 80 MHz —
Core Voltage 2.2 V —
I/O Voltage 3.3 V —
Process Technology 0.32 um CMOS 0.25 micron CMOS
Communications Processor Module (CPM) Integrated 32-bit RISC CPM with SCC/SMC —
Serial Communication Controllers (SCC) Up to 4 channels (Ethernet, HDLC, UART) —
Serial Management Controllers (SMC) 2 channels (UART/SPI/I2C) 2 channels
Ethernet MAC 10/100 Mbps Fast Ethernet —
DMA Channels 4 channels —
Memory Controller Integrated, up to 4 DRAM banks —
封裝 / 外殼 357-PBGA (25x25 mm) —
安裝類型 Surface Mount Surface Mount
Packaging Tray Tray
Lead Status Contains Lead Contains Lead (legacy PBGA)
RoHS 狀態 Non-Compliant RoHS non-compliant (legacy PBGA, contains lead)
工作溫度 [DATA_NEEDED: operating temperature range] -40 C to +95 C (industrial grade per suffix T)
MSL 等級 [DATA_NEEDED: MSL rating] —
Core Frequency — 80 MHz
Bus Width — 32-bit
Operating Voltage — 3.3 V
Number of Cores — 1
Cache Memory — [DATA_NEEDED: unified cache size in KB]
Serial Communications Controllers (SCC) — 4 channels
SPI Controllers — 2
I2C Interface — 1
封裝 — 357-BGA (PBGA), 25 x 25 mm

資料表與資源

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