MPC860ENCVR50D4 vs MPC860TCVR50D4 比較
詳細並排比較 MPC860ENCVR50D4 由 NXP Semiconductors 與 MPC860TCVR50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860ENCVR50D4 | MPC860TCVR50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 停產終止 |
| Processor Type | MPU PowerQUICC MPC8xx | MPC8xx PowerQUICC 32-bit microprocessor |
| Core Architecture | 32-Bit PowerPC | — |
| Core Count | 1 | 1 core |
| 最大時脈頻率 | 50 MHz | — |
| 工作電源電壓 | 3.3 V | — |
| Process Technology | 0.32 um CMOS | 0.32 micrometer |
| 封裝 / 外殼 | 357-BBGA (PBGA, 25 x 25 mm) | — |
| 安裝類型 | Surface Mount | Surface mount |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | RoHS Compliant | RoHS compliant |
| Series | MPC8xx PowerQUICC | — |
| 工作溫度範圍 | [DATA_NEEDED: operating temperature range] | — |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| 供應電壓 | — | 3.3 V |
| 封裝 | — | 357-pin PBGA, 25 x 25 mm |
| Package Type | — | 357-BBGA |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |