MPC862PCVR66B vs MPC860TZQ66D4 比較
詳細並排比較 MPC862PCVR66B 由 NXP Semiconductors 與 MPC860TZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC862PCVR66B | MPC860TZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 停產終止 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture, 32-bit | PowerPC, 32-bit |
| Core Count | 1 | 1 |
| Core Speed | 66 MHz | — |
| Operating Voltage | 3.3 V | — |
| 封裝 | 357-PBGA (25 x 25 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +105C | 0 °C to +70 °C |
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC | — |
| Process Technology | 0.32 um | — |
| Lead Free Status | Lead Free | Contains Lead |
| RoHS 狀態 | RoHS Compliant | RoHS non-compliant (Contains Lead) |
| Packaging | Tray | Tray |
| Lifecycle | No Longer Manufactured (last-time-buy per NXP discontinuance notice) | — |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| 供應電壓 | — | 3.3 V |
| 封裝 / 外殼 | — | 357-PBGA (25x25 mm) |
| Communications Module | — | CPM (QUICC Engine) |
| 生命週期狀態 | — | End of Life (per NXP) |
| 類別 | — | Microprocessors - MPU |