MPC885ZP66 vs MPC885VR66 比較

詳細並排比較 MPC885ZP66 由 NXP Semiconductors 與 MPC885VR66 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC885ZP66 MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC885ZP66 ✓ 啟用中
NXP Semiconductors
MPC885VR66 MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors

MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors

MPC885VR66 ✗ 停產

規格比較

參數 MPC885ZP66 MPC885VR66
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 停產終止
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Product Category Microprocessors (MPU) —
Processor Series PowerQUICC MPC8xx —
Core Architecture Power Architecture —
Core Count 1 1 core
資料匯流排寬度 32 bit —
最大時脈頻率 66 MHz 66 MHz
Instruction Cache 4 KB —
Data Cache 4 KB —
封裝 357-ball PBGA, 25 mm x 25 mm 357-PBGA (25 x 25 mm)
安裝類型 Surface Mount Surface Mount
工作溫度 0 C to +95 C (commercial) —
I/O Supply Voltage 3.3 V —
Core Supply Voltage 1.8 V —
Integrated Peripherals Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART —
Memory Controller SDRAM, DRAM, SRAM, Flash, ROM —
RoHS 狀態 Non-Compliant (legacy part) RoHS Compliant
Product Type — PowerQUICC Communications Processor
Processor Architecture — 32-Bit Power Architecture
Advertised Performance — 87 MIPS
供應電壓 — 3.3 V
Process Technology — 0.18 um
Package Family — 357-BBGA
Packaging — Tray
工作溫度範圍 — 0°C to 95°C
生命週期狀態 — End of Life
Lead-Free Status — Lead Free
REACH Status — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Internal Memory Configuration — [DATA_NEEDED: cache, SRAM, and ROM configuration]
External Memory Interfaces — [DATA_NEEDED: supported external memory interfaces]
Ethernet Capability — [DATA_NEEDED: Ethernet controller configuration]
Serial Interface Configuration — [DATA_NEEDED: UART, SPI, I2C, and CAN interface details]

資料表與資源

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