MPXV5010DP vs MPXV7025GP 比較
詳細並排比較 MPXV5010DP 由 NXP Semiconductors 與 MPXV7025GP 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ 啟用中規格比較
| 參數 | MPXV5010DP | MPXV7025GP |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Pressure Sensors | Pressure Sensors |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Pressure Type | Differential | Compound (positive and vacuum) |
| Operating Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | ±3.63 PSI (±25 kPa) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload] | [DATA_NEEDED: maximum overload pressure] |
| 輸出類型 | Analog, Ratiometric | Analog voltage |
| 輸出電壓範圍 | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| 供應電壓 | 5 V nominal (4.75 V to 5.25 V) | 5 V typical (ratiometric output) |
| Accuracy | 5 % (over 0 C to 85 C) | [DATA_NEEDED: accuracy %FS] |
| Response Time | 1 ms typical | — |
| 工作溫度 | -40 C to +125 C | -40C to +125C |
| Compensated Temperature | 0 C to 85 C | — |
| Port Style | Male, 0.13 in (3.3 mm) tube, Dual, Same Side | Single side port with barbed stem |
| 封裝 | 8-BSOP (0.475 in / 12.06 mm width), Dual Ports | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Technology | Piezoresistive, MEMS, On-chip Signal Conditioned | Piezoresistive MEMS with on-chip ASIC |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Output Span | — | 4.5 V (typical) |
| Pressure Port | — | Male - 0.13" (3.18 mm) Tube, Side |
| 供應電流 | — | [DATA_NEEDED: supply current] |
| 封裝 / 外殼 | — | 8-SMD, Gull Wing, Side Port |