MPXV7007GC6U vs MPXV7025GP 比較

詳細並排比較 MPXV7007GC6U 由 NXP Semiconductors 與 MPXV7025GP 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPXV7007GC6U MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U ✓ 啟用中

規格比較

參數 MPXV7007GC6U MPXV7025GP
品牌 NXP Semiconductors NXP Semiconductors
類別 Pressure Sensors Pressure Sensors
生命週期狀態 啟用中 啟用中
Product Type Integrated silicon pressure sensor —
Manufacturer NXP Semiconductors —
Pressure Range -7 kPa to +7 kPa (compound, ±1.02 PSI) —
Operating Pressure - Max +7 kPa —
Operating Pressure - Min -7 kPa —
供應電壓 5.0 V (typical) 5 V typical (ratiometric output)
供應電流 7 mA (typical) [DATA_NEEDED: supply current]
輸出類型 Analog, ratiometric Analog voltage
輸出電壓範圍 0.5 V to 4.5 V 0.2 V to 4.7 V
Output Span 4.0 V (typical, VFS - Voffset) 4.5 V (typical)
Accuracy ±1.5 %VFSS (max over compensated range) [DATA_NEEDED: accuracy %FS]
工作溫度 -40 °C to +125 °C -40C to +125C
Compensated Temperature 0 °C to +85 °C —
Port Type Axial, top port, accepts 3.17 mm (1/8 in) tube —
封裝 8-SMD, Gull Wing, Top Port (SOP-8) —
Package Dimensions 11.4 mm x 8.1 mm x 6.4 mm —
Technology MEMS piezoresistive, Wheatstone-bridge on-chip Piezoresistive MEMS with on-chip ASIC
Signal Conditioning On-chip amplifier, temperature compensation, calibration —
ESD Protection (Port) 2 kV HBM —
ESD Protection (Signal Pins) 200 V HBM —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes —
Pressure Type — Compound (positive and vacuum)
Operating Pressure Range — ±3.63 PSI (±25 kPa)
Maximum Overload Pressure — [DATA_NEEDED: maximum overload pressure]
Pressure Port — Male - 0.13" (3.18 mm) Tube, Side
封裝 / 外殼 — 8-SMD, Gull Wing, Side Port
Port Style — Single side port with barbed stem

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