S912XEG128BMAA vs MC9S12XDT256CAG 比較

詳細並排比較 S912XEG128BMAA 由 NXP Semiconductors 與 MC9S12XDT256CAG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S912XEG128BMAA S912XEG128BMAA - 16-bit 50MHz S12X MCU 128KB Flash | NXP

S912XEG128BMAA - 16-bit 50MHz S12X MCU 128KB Flash | NXP

S912XEG128BMAA ✓ 啟用中
NXP Semiconductors
MC9S12XDT256CAG MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG ⚠ 最後購買機會

規格比較

參數 S912XEG128BMAA MC9S12XDT256CAG
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 最後購買
Core Processor HCS12X —
Core Size 16-bit —
Core Architecture CISC with XGATE co-processor —
Operating Frequency (Bus Speed) 50 MHz —
Program Memory Size 128 KB (128K x 8) Flash —
Program Memory Type Flash with hardware-emulated EEPROM —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM (Emulated) Up to 4 KB (hardware-emulated) —
Number of I/O Pins 59 —
供應電壓 3.3 V / 5 V dual-voltage —
工作溫度範圍 -40 °C to +125 °C (automotive grade) —
封裝 80-QFP (14x14 mm), PQFP, tray 144-pin LQFP (20x20 mm)
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI —
ADC 12-bit, 3 µs conversion time 16-channel, 10-bit
Peripherals LVD, POR, PWM, WDT, ECT, PIT, RTI —
安裝類型 Surface Mount (gull-wing leads) Surface Mount
MSL 等級 3 (per JEDEC J-STD-020, typical for QFP) [DATA_NEEDED: MSL level]
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
AEC-Q100 Qualification Automotive qualified —
Core — HCS12X (16-bit CISC with XGATE co-processor)
Program Memory — 256 KB Flash
RAM — 16 KB
EEPROM — 4 KB
Maximum CPU Frequency — 80 MHz
Supply Voltage - Core — 2.35 V to 2.75 V
Supply Voltage - I/O — 4.5 V to 5.5 V
I/O Pins — 119
工作溫度 — -40C to +85C
CAN Controllers (MSCAN) — 5 (CAN 2.0 A/B)
SCI / SPI — Yes
PWM Channels — 8
Timers — ECT (Enhanced Capture Timer)
Debug Interface — BDM (Background Debug Mode)
生命週期狀態 — No Longer Manufactured (per NXP product page)

資料表與資源

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